Gerlinger Industries hot-melt adhesive films are available both on CoPolyamide (CoPA), CoPolyester (CoPES) and on polyolefins (PO). Activation temperatures from 70 ° C up to 185 ° C and the compatibility with a large number of additional substrates allows us to meet every requirement.
With selected CoPolyester grades, a permanent heat resistance of up to 160 ° C can be exhibited. In particular, the reliable bonding of or with metals and other natural substrates can be effected by melt-adhesive films based on copolymers. Take advantage of our long-standing experience with various bonding technologies and contact us.